Phase Change Material (PCM) Thermal interface materials are intelligent thermal management materials that undergo a phase transition from solid to liquid (or vice versa) at a specific temperature (phase change temperature). In the field of electronic heat dissipation, the phase change thermal conductive material usually refers to a compound or composite material that undergoes a solid-liquid phase change within the operating temperature range of the device, and is specifically used to fill the interface gap between the heating element and the heat sink.

Thermal grease (Thermal Grease/Paste), commonly known as thermal paste and thermal paste, is a paste thermal interface material (TIM) made of silicone oil as base oil, adding high thermal conductivity fillers (such as alumina, zinc oxide, boron nitride, silicon carbide, etc.) and functional additives. It is mainly used to fill the microscopic voids and concave-convex surfaces between heating electronic components (such as CPU, GPU) and heat sinks, replace air with low thermal conductivity, establish an efficient heat conduction path, and realize heat

The thermal pad is a solid sheet material with thermal conductivity, which is usually made of a thermal conductive filler (such as ceramic particles, metal oxides, etc.) and a polymer matrix (such as silicone rubber, polyurethane, acrylic, etc.). It fills the gap between the heat-generating electronic component and the heat sink, replaces the air gap, and establishes an efficient heat conduction path to transfer heat from the heat source to the heat sink, thereby reducing the operating temperature of the electronic device.

Thermal conductive gel is a kind of paste thermal interface material with both thermal conductivity and fluidity, which is between traditional thermal conductive silicone grease and solid gasket. It is usually composed of silicone, epoxy or polyurethane polymer matrix and high thermal conductivity filler (such as alumina, boron nitride, zinc oxide, etc.). It has non-curing or semi-curing characteristics and can maintain viscoelastic state for a long time. The thermally conductive gel is able to fill irregular surfaces and large gaps while avoiding the pumping problems of traditional silicone greases and the stress problems of gaskets.

Thermal potting glue is a potting material designed for efficient heat dissipation. It provides the sealing, insulation and protection functions of traditional potting glue, and provides excellent thermal management capabilities by adding high thermal conductivity fillers. This kind of material is poured into the cavity of the electronic device in the form of liquid or paste, and after curing, it forms a solid packaging layer with thermal conductivity, which quickly conducts the heat generated by the component to the housing or heat dissipation structure, and provides comprehensive environmental protection.

Conductive adhesive is a kind of electronic bonding material that makes insulating polymer matrix conductive by adding conductive filler. It combines the bonding/sealing properties of polymer materials with the conductive properties of metal materials, and is mainly used for the mechanical connection and electrical interconnection of electronic components. Conductive adhesive fills the gap between traditional welding and mechanical connection, especially suitable for the connection of heat sensitive, fine pitch and heterogeneous materials.