network communication

With the continuous improvement of the intelligent degree of electronic products, especially as the core equipment of the Internet, network communication products are developing in the direction of high speed, high quality and easy management. This puts forward higher requirements for the quality of Netcom products. However, with the increase in operating frequency, operating intensity and network speed, these products are facing increasing power and heat dissipation requirements. In the thermal design of electronic products, thermal interface materials play an important role, which can improve the heat dissipation efficiency, improve the operating speed, stability, reliability and service life of the product.

In the router, it is mainly composed of hardware such as memory, power supply, CPU, cable, CSU/DSU, vendor media, interface and module. As a medium for connecting to the Internet, routers need to provide strong network transmission speeds, but this is bound to generate a lot of heat. If too much heat is generated during the work, it will affect the wireless signal, such as unstable signal or disconnection. In addition, in order to save cost and space, routers are developing in the direction of miniaturization, which increases the difficulty of heat dissipation.

Under normal circumstances, the router uses passive heat dissipation, heat dissipation through the heat dissipation holes on the body. However, the heat dissipation efficiency by the heat dissipation holes alone is not high. Therefore, in thermal design, engineers usually use thermally conductive silicone gaskets in combination with the shell to improve the heat dissipation performance and working stability of the router.

When selecting a thermal silicone gasket, it is necessary to determine the appropriate specifications, thickness, thermal conductivity and other parameters according to the components that generate heat (such as CPU, memory, Modem module). This ensures that the thermally conductive silicone gasket can effectively conduct heat and spread it to the housing to achieve better heat dissipation.

For switches, in the development of the information age, the network has become an indispensable part of life. As a common information exchange device, the switch connects the server and the network, and is an important part of building a data center. With the maturity of communication technology, the exchange of information between people becomes more and more frequent, which makes the load of the switch continue to increase. As a result, switches face the challenge of balancing increased performance with reduced power consumption.

The switch is connected to multiple ports and carries a large load power. During operation, each internal module generates a large amount of heat. If this heat accumulates inside the switch, it will cause the internal temperature to rise, which will affect the working performance of the switch, shorten the service life, and even cause damage to the internal electronic components. Therefore, in order to ensure the reliability and safety of the switch, the thermal design of the equipment is very important.

For chips that generate a large amount of heat, a thermally conductive silicone gasket can be selected to fill and contact the gap between the chip surface and the housing to form a thermally conductive channel for heat transfer. In this way, the operating temperature of the chip can be controlled within a safe range, thereby ensuring the reliability and safety of the switch.

In summary, the application of thermal silicone gaskets in netcom products such as routers and switches plays an important role in improving heat dissipation efficiency, improving product performance and extending service life. By reasonably selecting the specifications and parameters of the thermal silicone gasket, the heat of electronic products can be effectively managed and controlled, and its operation stability and reliability can be improved.