Thermally Conductive Gel (-8.0)
Thermally Conductive Gel (-8.0)
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Thermally conductive gel -8.0 is a kind of high-performance thermally conductive interstitial material, which has the characteristics of low interfacial thermal resistance and good thixotropy, and is an ideal material for large gap tolerance applications. Unlike thermal pad materials, thermally conductive gap filling materials can provide unlimited thickness changes with little or no stress on sensitive components during assembly. Thermally Conductive Gel -8.0 provide a soft, thermally conductive, form-in-place elastomer, ideal for fragile components and filling unique and complex air gaps and gaps. It fills in the need for cooling
Product characteristics
Thermally conductive gel -8.0 can be used manually or with dispensing equipment.
Typical applications
| Product Performance | Test Results | Test Method |
| Component Composition | Silica Gel Filled with Ceramic Particles | - |
| Color | beige white | visual inspection |
| Density | 3.4g/cc | helium true density method |
| Shore hardness | 5 (Shore OO) | ASTM D2240 |
| Viscosity/Flow @ 90psi,1" | 25 g/min | - |
| Minimum bonding thickness | 0.15mm | - |
| Use temperature range | -50 to 200℃ | - |
| UL fire rating | V0 | 94UL |
| Air flow (TML) | <0.5% | ASTM E595 |
| Preservation period | 12 months |
|
| Thermal performance |
| thermal conductivity | 8.1W/mK | Hot Disk |
| 8.2 W/mK | ASTM D5470 |
| Thermal resistance @ 50psi/50 ℃ | 0.038℃-in2/W | ASTM D5470 |
Industry and Communications
Automotive Electronics
Consumer Electronics
Medical and Aviation
