Power supply thermal conductive silicone sheet has become a trend of rapid development

The thermal conductivity of thermal conductive silica gel is 1-6W/mK, and the voltage breakdown resistance is above 4000V. The product itself has certain flexibility, and is well fitted between the power device and the heat dissipation aluminum sheet or the machine shell to achieve the best heat conduction and heat dissipation purpose, which meets the current requirements of the electronic industry for thermal conductive materials. Soft silica gel thermal conductive insulation pad is one of the heat transfer interface materials, with good heat conduction ability and high pressure resistance, its function is to fill the large requirement between the processor and the radiator, and it is the best product to replace the binary heat dissipation system of thermal conductive silicone grease and mica sheet.

The most convenient thermal silica gel is that the product can be cut at any size, which is more conducive to automatic production and product maintenance, and is more convenient to use. The process thickness generally ranges from 0.5mm to 5mm, one plus every 0.5mm, I .e. the 0.5mm 1mm 1.5mm is 2mm to 5mm, and can be increased to 13mm if there are special requirements. It is specially produced for the design scheme of heat transfer by using the gap, which can fill the gap and complete the heat transfer between the heating part and the heat dissipation part. At the same time, it can also play the role of shock absorption, insulation and sealing, and can meet the design requirements of miniaturization and simplicity of equipment in the society. It is a new energy material with practicality and technology.

Moreover, the thickness of thermal silica gel is widely used, especially in the electronic equipment industry of automobiles, computers, monitors and power supplies, etc., and plays a particularly critical role.