The role of thermally conductive silicone pads-the key material for electronic devices to "work calmly"

In modern electronic equipment, the more powerful the performance, the more prominent the heat problem. Whether it is high-speed chips, power modules, or new energy vehicle control units, efficient and reliable thermal management solutions are required. Among the many thermal management materials, the thermal conductive silicone pad (Silicone Thermal pad) has become an important bridge between the heat source and the radiator because of its excellent thermal conductivity, soft physical properties and stable electrical insulation performance.

The core role of thermal conductive silicone pad

Thermal conductive silicone pad is a kind of polymer thermal interface materials (TIMs) made by special process with silicone as the base material and adding thermal conductive filler.

Its main role can be summarized in the following three points:

1. Improve heat conduction efficiency

    Between the electronic components and the heat sink, the surface is usually not completely flat, there is a small air gap. Air is a very poor thermal conductor, which seriously affects heat transfer. The thermal conductive silicone pad fully fills the contact surface gap through its soft and compressible characteristics, greatly reduces the thermal resistance, and realizes the efficient conduction of heat.

2. Provide electrical insulation protection

    In many application scenarios, electronic components need to not only conduct heat, but also maintain electrical isolation. Thermally conductive silicone pads combine excellent electrical insulation to prevent the risk of short circuits and leakage and ensure safe operation of the system.

3. Buffer and shock absorption

    The silicone material itself has a certain degree of elasticity and flexibility, which can play a buffering and damping effect in mechanical assembly, reduce stress concentration under thermal cycling or vibration environment, and thus extend the life of the device.