Ultra-soft thermal gasket: light and thin electronic era of heat dissipation just needed

Thermal Challenges of Miniaturization of 1. Electronic Devices

With the continuous development of electronic products such as smart phones, tablet computers, and wearable devices, traditional heat dissipation solutions are facing severe challenges. The metal heat sink is too large, the graphite sheet is not flexible enough, and there is a risk of leakage of liquid metal-the industry urgently needs an innovative solution that can adapt to compact spaces and conduct heat efficiently.

The Breakthrough Advantage of 2. Super Soft Thermal Conductive Gasket

1. Extreme Compliant Features
The material has a soft silicone-like texture, which can perfectly fit the heating element and the heat dissipation shell under extremely low pressure, filling the microscopic voids that are difficult to handle with traditional materials.

2. Intelligent interface adaptation
Automatically adapt to different surface roughness, in the chip package, battery pack and other irregular contact surface to form a non-air gap heat conduction channel, significantly reduce the interface thermal resistance.

3. Shock absorption and buffer protection
While fulfilling the mission of thermal conductivity, it provides additional mechanical cushioning for precision electronic components, effectively resisting transportation shocks and daily drop impacts.

3. Innovation Electronic Thermal Design Paradigm

Space utilization: 0.3mm ultra-thin specifications to release valuable design space, help product thickness to break the limit

Simplified assembly process: no screw fixing or welding process of traditional heat dissipation scheme is required, greatly improving production efficiency

Reliability upgrade: avoid the risk of short circuit of metal heat sink, solve the problem of dry aging of phase change materials

4. typical application scenarios

Folding screen mobile phone: dynamic heat dissipation in the hinge area to ensure that the performance is not attenuated after multiple bends

TWS headphones: Build a complete thermal management path in a pea-sized charging bin

MiniLED backlight: Provides uniform temperature control for high-density LED arrays

Automotive electronics: adapt to the vibration environment of the engine compartment to ensure the stable operation of the ADAS system

5. future evolution direction

As electronic equipment continues to develop towards flexibility and integration, the next generation of ultra-soft thermal gaskets will focus on:

Anisotropic thermal conductivity: to achieve ultra-high thermal conductivity in the plane direction, good insulation in the thickness direction

Self-repair function: automatic recovery of thermal conductivity after slight damage

Environmentally friendly and degradable: meeting the green manufacturing requirements of global electronic products

This seemingly simple material innovation is redefining the heat dissipation design standards in consumer electronics, automotive electronics, medical equipment and other fields, and has become a key material to support the continuous evolution of future technology products.