Thermal gasket (-3.0)

Thermal conductive gasket -3.0 is a gap filling thermal conductive gasket with high deformation recovery rate. Its thermal conductivity can reach 1.5W/mK, and its softer hardness enables it to exhibit smaller thermal resistance under low pressure. At the same time, it excludes the air between components and circuit boards, and fully fills various rough surfaces.

Product characteristics

It is self-adhesive and does not require additional adhesive coating.

Typical applications

Product Instruction

Technical parameters

Product Performance	Test Results	Test Method
Component Composition	Ceramic Grain Filled Silicone Sheet	-
Color	light blue	visual inspection
Thickness range	0.020"-0.320" (0.5-8mm)	-
Specific Gravity	1.75g/cc	helium true density method
Shore hardness	40(Shore 00)	ASTM D2240
Tensile strength	15 psi	ASTM D412
% Elongation	95	ASTM D412
Shape variable @ 3mm,60psi	50%	ASTM D575
Use temperature range	-50℃ to 200℃	-
UL fire rating	94V0	UL
Thermal performance
thermal conductivity	1.3 W/mK	Hot Disk
thermal conductivity	1.5 W/mK	ASTM D5470
Thermal Resistance @ 40mil,20psi	0.90℃-i㎡/W	ASTM D5470
electrical properties
dielectric breakdown strength	>250 VAC/mil	ASTM D149
volume resistance	6x1013ohm-cm	ASTM D257
Dielectric constant @ 1MHz	5.5	ASTM D150

Application Scenarios

LCD and plasma TV

LED lighting equipment

Semi-thermal heat dissipation device

laptop and web server

Power supply equipment

Memory Storage Module

Communication equipment

Graphics