Thermal gasket (-2.0)

Thermal conductive gasket -2.0 is a soft gap filler thermal conductive gasket. Due to its soft hardness, it can show less thermal resistance under low pressure, while excluding the air between components and circuit boards, and fully filling all kinds of rough surfaces.

Product characteristics

Thermal conductive gasket-The 2.0 is self-adhesive and does not require an additional adhesive coating.

Typical applications

Product Instruction

Technical parameters

Product Performance	Test Results	Test Method
Component Composition	Ceramic Grain Filled Silicone Sheet	-
Color	light gray	visual inspection
Thickness range	0.020"-0.320" (0.5-8mm)	-
Specific Gravity	3.0g/cc	helium true density method
Shore hardness	45(Shore OO)	ASTM D2240
Tensile strength	35 psi	ASTM D412
% Elongation	85%	ASTM D412
Shape variable @ 3mm/60psi	40%	ASTM D575
Use temperature range	-50℃ to 200℃	-
UL fire rating	94V0	UL
Thermal performance
thermal conductivity	2.4 W/mK	Hot Disk
thermal conductivity	2.6 W/mK	ASTM D5470
Thermal resistance @ 40mil/20psi	0.50℃-in2/W	ASTM D5470
electrical properties
dielectric breakdown strength	>250 VAC/mil	ASTM D149
volume resistance	>1x1011 ohm-cm	ASTM D257
Dielectric constant @ 1MHz	5.5	ASTM D150

Application Scenarios

LCD and plasma TV

LED lighting equipment

Semi-thermal heat dissipation device

laptop and web server

Power supply equipment

Memory Storage Module

Communication equipment

Graphics