Thermal paste (-5.5W)
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Thermal conductive paste -5.5W is a high-performance thermal conductive paste based on silicone resin, which is used in chip components such as CPU and GPU with high heat dissipation requirements. Its excellent wettability can make it quickly fill in the interface micropores, which can greatly reduce the interface thermal resistance. The thermal paste -5.5W has stable performance, will not dry and hard under normal storage conditions, and has good thixotropy, which is convenient for customers to use.
Product characteristics
1. The thermal conductivity can reach 5.5 W/m K and the thermal resistance is as low as 0.06 oC cm/W.
2, ultra-low application thickness, minimum up to 20 um
3, add a large number of nanoparticles, can better fill the small gap, reduce the interface thermal resistance
4. Compliance with RoHS and REACH requirements
Typical applications
