Thermal paste (-3.5W)

Thermal paste -3.5W uses silicon-based materials and is a high-performance thermal paste designed for high-end CPU, GPU and custom chip assembly. Due to its excellent wetting properties, the thermal paste -3.5W can fill the tiny irregularities on the surface of the component, thereby achieving extremely low thermal resistance.

Product characteristics

The thermal paste -3.5W has stable performance and will not dry up, precipitate or harden. It is easy for customers to use.

Typical applications

Product Instruction

Technical parameters

Product Performance	Test Results	Test Method
Component Composition	Silicone Resin Filled with Ceramic Particles	-
Color	Grey	visual inspection
Density	2.8g/cc	helium true density method
Viscosity	<400,000cps	ASTM D2240
Volatile (@ 150 ℃,24h)	≤0.3%	-
Use temperature range	-50℃ to 200℃	-
Storage conditions	8~28 oC	-
Preservation period	12 months	-
Thermal performance
coefficient of thermal conductivity	3.5 w/m · K	Hot Disk
Thermal Resistance (@ 50 ℃,50psi)	0.022℃·in2/W	ASTM D5470
electrical properties
volume resistivity coefficient	>1.0x10 13 ohm-cm	ASTM D257

Application Scenarios

cpus

Ipad, handheld video game

Heat conduction between semiconductor and heat sink

High power LED heat dissipation

Heat conduction in communication products

Power components with no special insulation requirements

Chipset (Northbridge, Southbridge)